Fabs, process nodes, HBM and the supply chain that everything in AI ultimately depends on.
389 articles
Anthropic is reportedly in early-stage discussions with Samsung Electronics to develop a custom AI chip. The project aims to potentially reduce reliance on third-party hardware, though specific technical requirements remain undefined.
The Next Web (TNW) · 79d ago
The surge in demand for high-performance AI and storage chips in smart EVs has led to significant price hikes, forcing manufacturers to abandon price wars. Automotive semiconductor costs now account for 8-20% of total vehicle price.
虎嗅 · 79d ago
SK Hynix plans to build a massive new NAND flash memory factory, M17, in Cheongju, South Korea. The facility is designed to meet the surging demand for high-capacity memory required by AI applications, with production slated for 2029.
The Next Web (TNW) · 79d ago
Samsung Electronics is accelerating the development of its 1.4nm (SF1.4) process node, targeting a 2029 mass production timeline. The company is deepening collaborations with Applied Materials and Lam Research to optimize equipment for this advanced node.
IT之家 · 81d ago
BOE is pivoting from traditional display panels to AI infrastructure by developing glass-based packaging substrates. This technology is critical for next-generation AI chip packaging, offering superior performance over organic substrates.
36氪 · 82d ago
South Korea has announced a massive $1 trillion investment strategy aimed at bolstering its semiconductor and artificial intelligence sectors. This move is a direct response to increasing competition from regional rivals like Taiwan, China, and Japan.
BBC Technology · 82d ago
Samsung Electronics plans to build a new advanced semiconductor packaging plant in Gwangju to address the surging demand for AI-related chips. The company is also diversifying investments across robotics, biotech, and battery sectors to strengthen its AI ecosystem.
IT之家 · 82d ago
South Korea has announced a major initiative to maintain its global leadership in AI by prioritizing large-scale investments in memory chips, data centers, and robotics. Industry giants Samsung Electronics and SK Hynix are central to this national strategy.
Bloomberg Technology · 82d ago
Morgan Stanley reports that Nvidia remains the largest customer for TSMC's CoWoS advanced packaging through 2027. Nvidia's Blackwell and Rubin AI GPUs will utilize CoWoS-L, with demand projected to reach 910,000 units.
cnBeta (Full RSS) · 83d ago
Samsung is reportedly planning a massive $647.5 billion investment in South Korea over the next decade. This capital injection aims to bolster semiconductor manufacturing capacity to address global chip shortages.
The Next Web (TNW) · 85d ago
IBM has announced a groundbreaking sub-1nm chip technology featuring a 0.7nm node and a new 'Nanostack' architecture. This development aims to push the physical limits of semiconductor scaling to enhance performance and energy efficiency.
cnBeta (Full RSS) · 86d ago
IBM has announced a breakthrough in semiconductor manufacturing by unveiling the world's first sub-1 nanometer chip technology. This development marks a significant milestone in hardware scaling, potentially enabling more powerful and energy-efficient AI compute infrastructure.
Bloomberg Technology · 86d ago
IBM has announced a breakthrough in semiconductor technology with the development of sub-1 nanometer nanostack transistors. This innovation aims to significantly enhance chip performance and energy efficiency for future computing needs.
Ars Technica · 86d ago
Dutch tech giants ASML and NXP are joining a government-led trade mission to China. This move highlights the tension between the Netherlands' desire to maintain trade relations and the pressure from the US to restrict high-tech exports.
SCMP Technology · 86d ago
Chinese chip giant JCET is investing 7.8 billion yuan to build a new advanced packaging and testing facility in Shanghai's Lin-gang Special Area. This expansion aims to meet the surging demand for domestic AI-capable chips.
SCMP Technology · 86d ago
TSMC is reportedly increasing foundry prices for its 7nm and more advanced nodes by 5% to 10%. This adjustment affects approximately 75% of the company's wafer revenue.
cnBeta (Full RSS) · 87d ago
Dutch chip startup Euclyd, backed by former ASML CEO Peter Wennink, is initiating a €200 million Series A funding round. The company aims to leverage this capital to advance its semiconductor technology development.
Bloomberg Technology · 87d ago
Micron has entered a strategic partnership with Anthropic to integrate Claude into its semiconductor design and manufacturing processes. This move aims to leverage AI to accelerate innovation in memory and storage hardware development.
Ifanr (爱范儿) · 87d ago
MediaTek is reportedly planning to increase the price of its flagship Dimensity 9600 series, with the Pro model potentially reaching $216. The price hike is driven by increased demand for high-end mobile SoCs and the use of advanced TSMC manufacturing processes.
IT之家 · 88d ago
SK Hynix has overtaken Samsung Electronics as South Korea's most valuable company during intraday trading. This shift highlights the massive market demand for high-bandwidth memory (HBM) chips, which are critical for AI hardware.
The Next Web (TNW) · 89d ago
Ming-Chi Kuo highlights that glass core substrates are no longer optional but a requirement for future AI chip manufacturing. TSMC is collaborating with Ibiden and Innolux to develop a three-layer glass-core structure.
cnBeta (Full RSS) · 91d ago
Researchers from the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) have demonstrated a 4-layer 3D 2T0C DRAM structure using IGZO materials. This breakthrough achieves 3 bits per cell and a 400-second data retention time.
IT之家 · 91d ago
The US government claims a high-end ASML chip manufacturing tool has reached China, while ASML denies the allegation. This dispute highlights the intense geopolitical scrutiny surrounding advanced semiconductor supply chains.
The Next Web (TNW) · 92d ago
The US Commerce Department has raised concerns with ASML regarding reports that a top-tier chip-making machine may have been exported to China, potentially violating US-led trade restrictions. This development highlights the intensifying pressure on semiconductor supply chains amid ongoing geopolitical tensions.
Bloomberg Technology · 92d ago
President Trump announced a partnership between Intel and Apple to design and manufacture chips within the United States. This move aims to bolster domestic semiconductor production and reduce reliance on overseas manufacturing hubs like Taiwan.
cnBeta (Full RSS) · 93d ago
President Donald Trump announced that Apple has agreed to collaborate with Intel to design and manufacture chips domestically in the United States. This development, shared via Truth Social, marks a significant shift in Apple's supply chain strategy toward American soil.
The Next Web (TNW) · 93d ago
The US Department of Commerce has awarded SandboxAQ $500 million under the CHIPS Act. The funding aims to leverage AI to discover new chemicals and metals for domestic semiconductor manufacturing, reducing reliance on Chinese supply chains.
The Next Web (TNW) · 94d ago
Intel introduced the 18A-P process node, an enhancement of 18A, offering significant power and performance gains. The process will debut in the 'Diamond Rapids' product line.
cnBeta (Full RSS) · 94d ago
Intel has detailed its future roadmap focusing on three key technologies: CFET, Gallium Nitride (GaN) on silicon, and Ruthenium interconnects. These innovations aim to push the boundaries of process node scaling.
量子位 · 94d ago
Morgan Stanley reports that Intel's next-generation 14A process node has achieved a defect density (D0) of approximately 0.5. This indicates strong yield maturity ahead of the trial production phase, signaling a positive outlook for Intel's foundry business.
cnBeta (Full RSS) · 95d ago