Fabs, process nodes, HBM and the supply chain that everything in AI ultimately depends on.
389 articles
Huawei's Tao Law V2 data reveals the Kirin 2026 chip achieves a density of 238MTr/mm² using LogicFolding technology. This breakthrough signals a significant advancement in semiconductor efficiency.
Pandaily · 67d ago
SK Hynix CEO Kwak Noh-Jung warns that the global memory chip supply shortage will persist and potentially worsen. The market imbalance is expected to continue until at least 2030 due to high demand.
cnBeta (Full RSS) · 67d ago
Samsung is developing a dedicated AI accelerator chip codenamed 'GAIA' to enhance PC computing power. HP and Lenovo have reportedly begun testing prototypes of this new hardware.
cnBeta (Full RSS) · 68d ago
TSMC is struggling to meet the explosive demand for CoWoS advanced packaging driven by AI and HPC chips. This supply gap is causing major clients to divert orders to Intel and other local packaging firms.
cnBeta (Full RSS) · 69d ago
Shenzhen-based Cloud Leopard Intelligent has filed for a ChiNext IPO, aiming to become the first domestic DPU stock. The company is backed by Tencent as its largest shareholder and focuses on high-performance DPU SoC chips for AI computing.
36氪 · 69d ago
Samsung Electronics plans to start production at its first Yongin semiconductor plant by 2029, one to two years ahead of schedule. This move aims to meet the surging global demand for AI-specific chips.
36氪 · 69d ago
The DRAM industry has evolved from a cutthroat 'blood bath' of ten players to a consolidated oligopoly of three, driven by massive capital expenditure and strategic survival bets.
虎嗅 · 73d ago
SK Hynix is closing its $28 billion ADR book-building process early due to significant oversubscription. This marks one of the largest equity offerings globally, highlighting strong investor confidence in the memory chip sector.
36氪 · 73d ago
DeepSeek is reportedly developing custom AI chips specifically optimized for inference tasks. The project has been underway for over a year, with the company quietly engaging with design firms, foundries, and memory suppliers.
量子位 · 73d ago
Huawei's Tao's Law V2 paper introduces 'Logic Folding' to increase transistor density in 5nm chips. This innovation allows for higher performance without relying on advanced EUV lithography.
Pandaily · 73d ago
Samsung reported a massive 19x year-over-year increase in quarterly operating profit, driven by high demand for AI-related memory chips. Despite record-breaking results, the stock price fell as investors shifted focus to free cash flow and shareholder returns.
虎嗅 · 74d ago
Chinese AI startup DeepSeek is developing its own AI inference chips to reduce reliance on Nvidia and Huawei. The project is currently in the early stages and represents a major strategic shift for the company.
cnBeta (Full RSS) · 74d ago
Ningbo Jingpan Electronic Materials, a subsidiary of Jiangfeng Electronics, has increased its registered capital from 50 million to 820 million RMB. The company specializes in advanced electronic materials and display components.
36氪 · 74d ago
Synopsys is discontinuing its EES and FDC manufacturing software to pivot resources toward high-margin AI design tools. The move affects major clients like Samsung and SK Hynix as the company shifts focus to AI-driven semiconductor design.
IT之家 · 74d ago
Due to relaxed JEDEC standards regarding HBM stack thickness, major memory manufacturers Samsung and SK Hynix are reportedly delaying the adoption of hybrid bonding until the HBM4E generation. This shift reflects ongoing technical adjustments in the high-bandwidth memory supply chain.
cnBeta (Full RSS) · 74d ago
Huawei has unveiled its new LogicFolding architecture, which significantly increases transistor density in the upcoming Kirin 2026 processor. This breakthrough allows for performance gains without requiring more advanced lithography technology.
SCMP Technology · 75d ago
SK Hynix is planning a public offering of 177.9 million American Depositary Shares (ADS). Cornerstone investors have expressed interest in purchasing up to $7 billion worth of these shares.
36氪 · 75d ago
Samsung Electronics is expected to report a massive surge in operating profit for the June quarter, driven by the global AI-led demand for memory chips. Analysts project a 18x increase in profit compared to the previous year.
cnBeta (Full RSS) · 75d ago
Huawei's He Tingbo has published the Tao's Law V2 paper, introducing 'LogicFolding' technology. This innovation increases transistor density by 53.5%, enabling future Kirin processors to reach frequencies exceeding 4GHz.
Pandaily · 76d ago
Micron Memory Japan has broken ground on a new cleanroom at its Hiroshima plant to meet surging AI-driven memory demand. The project involves a total investment of 1.5 trillion yen, with equipment installation scheduled for late 2028.
ITmedia AI+ (日本) · 76d ago
By 2026, Huawei and Cambricon are expected to secure the majority of SMIC's advanced manufacturing capacity. This creates a competitive bottleneck for other domestic AI chip firms.
钛媒体 · 76d ago
Micron Technology has begun construction on a $9.3 billion expansion of its Hiroshima facility to meet surging demand for AI-driven memory. The site will focus on producing high-bandwidth memory (HBM) and stacked DRAM, which are critical components for AI hardware.
The Next Web (TNW) · 77d ago
Micron Technology has officially begun construction on a $9.3 billion expansion of its manufacturing facility in western Japan. The plant is dedicated to producing advanced memory chips essential for high-performance computing and AI workloads.
Bloomberg Technology · 77d ago
Silicon photonics startup Light-Link Tech has raised 100 million RMB in Pre-A funding to expand its R&D and mass production capabilities. The company specializes in miniaturized spectral sensing modules using computational spectroscopy for health and industrial applications.
36氪 · 77d ago
Apple and Tencent are reportedly targeting CXMT (ChangXin Memory Technologies) for its latest generation of mobile memory chips. This move signals a potential shift in the memory market long dominated by Samsung, SK Hynix, and Micron.
虎嗅 · 78d ago
Infineon has officially opened its Smart Power Fab in Dresden, Germany, representing a 5 billion euro investment. The facility aims to boost capacity for AI data center power supplies, automotive software, and renewable energy.
IT之家 · 78d ago
Anthropic is reportedly in early-stage discussions with Samsung Electronics to develop a custom AI chip. The project aims to potentially reduce reliance on third-party hardware, though specific technical requirements remain undefined.
The Next Web (TNW) · 78d ago
The surge in demand for high-performance AI and storage chips in smart EVs has led to significant price hikes, forcing manufacturers to abandon price wars. Automotive semiconductor costs now account for 8-20% of total vehicle price.
虎嗅 · 79d ago
SK Hynix plans to build a massive new NAND flash memory factory, M17, in Cheongju, South Korea. The facility is designed to meet the surging demand for high-capacity memory required by AI applications, with production slated for 2029.
The Next Web (TNW) · 79d ago
Samsung Electronics is accelerating the development of its 1.4nm (SF1.4) process node, targeting a 2029 mass production timeline. The company is deepening collaborations with Applied Materials and Lam Research to optimize equipment for this advanced node.
IT之家 · 81d ago