Latest Semiconductors News & Updates

Fabs, process nodes, HBM and the supply chain that everything in AI ultimately depends on.

381 articles

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Pandaily3d ago

CXMT Nears Mass Production of 12,800 Mbps LPDDR6 DRAM

ChangXin Memory Technologies (CXMT) is finalizing validation for its LPDDR6 mobile DRAM, targeting a 12,800 Mbps design rate. The company is positioning itself for mass production by H2 2026, with Apple currently evaluating the technology.

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虎嗅19d ago

TSMC Q2 2026 Earnings: AI Growth and Capex Surge

TSMC reported strong Q2 2026 revenue driven by AI chip demand, with 3nm processes reaching full capacity. The company significantly raised its annual capital expenditure guidance to $60-64 billion to support 2nm ramp-up.

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36氪19d ago

TSMC commits to stable pricing for long-term growth

TSMC Chairman C.C. Wei stated that the company will not drastically increase prices despite supply constraints. The pricing strategy focuses on sustainable growth and supporting client success.

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IT之家19d ago

TSMC Increases US Investment to $265 Billion

TSMC Chairman C.C. Wei announced an additional $100 billion investment in US operations, bringing the total commitment to $265 billion. This expansion includes six wafer fabs, three advanced packaging facilities, and a major R&D center.

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Bloomberg Technology19d ago

TSMC Beats Estimates Amid Sustained AI Demand

TSMC reported quarterly profits that exceeded market expectations. This performance underscores the ongoing strong global demand for AI computing hardware.

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虎嗅19d ago

ASML Q2 Revenue Surges; High NA EUV Reaches Milestone

ASML reported strong Q2 2026 results with a 21% revenue increase, driven by high demand for lithography equipment in logic and memory chip manufacturing. The company confirmed the successful integration of High NA EUV technology with Intel for 18A process nodes.

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IT之家20d ago

Apple seeks to acquire AI chip companies

Apple is actively seeking to acquire semiconductor startups to bolster its internal AI server capabilities. The company is shifting its financial strategy to support multi-billion dollar acquisitions to improve AI performance.

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The Next Web (TNW)20d ago

ASML’s $400M machine prints first laptop processors

ASML's advanced High NA EUV lithography machine has begun printing layers for Intel's Panther Lake processors. This milestone marks an early deployment of next-generation chipmaking technology.

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36氪20d ago

ASML Q2 Revenue Hits €9.3B, Raises 2026 Guidance

ASML reported strong Q2 2026 results with €9.3 billion in revenue and a 54% gross margin. The company raised its full-year guidance, citing robust demand for semiconductor manufacturing equipment.

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36氪22d ago

TSMC June Revenue Grows 67.9% Year-over-Year

TSMC reported June revenue of 442.68 billion TWD, marking a 67.9% increase year-over-year and 6.2% month-over-month. Total revenue for the first half of 2026 reached 2.4 trillion TWD, up 35.6%.

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36氪23d ago

SK Hynix Raises $26.5B for Semiconductor Expansion

SK Hynix raised $26.5 billion via ADRs to fund the Yongin Semiconductor Cluster and Cheongju P&T7 advanced packaging plant. The investment includes purchasing EUV lithography equipment to boost production capacity.

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虎嗅28d ago

Samsung Q2 profit surges on AI memory demand

Samsung Electronics reports a massive surge in Q2 2026 profits, driven by the high demand for AI-focused memory products like HBM4 and the development of UFS 5.0 storage solutions.

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cnBeta (Full RSS)29d ago

Intel plans 14A Gen2 process to challenge 1.4nm rivals

Intel is reportedly upgrading its roadmap to include a '14A Gen2' process to compete with TSMC and Samsung's upcoming 1.4nm chip manufacturing technologies. This move emphasizes Intel's strategy to maintain competitiveness in the high-performance AI chip foundry market.

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cnBeta (Full RSS)31d ago

Peking University Develops Neuromorphic Chip Outperforming Nvidia GPUs

A team from Peking University and the Chinese Academy of Sciences has developed the world's first memristor-based neuromorphic chip. The chip achieves a 478x speed increase over Nvidia GPUs in neural computing tasks by integrating storage and computation.

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cnBeta (Full RSS)31d ago

Samsung secures major Meta ASIC order for AI chips

Samsung Electronics has secured a significant ASIC production order from Meta, strengthening its position as a key manufacturing hub for AI giants like Tesla and Anthropic. The company's backlog is approaching 50 trillion KRW.

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cnBeta (Full RSS)33d ago

Samsung and SK Hynix Launch $870B AI Infrastructure Plan

Samsung and SK Hynix have announced a massive $870 billion investment over the next decade to expand semiconductor manufacturing and AI data center capacity in South Korea. This strategic move aims to strengthen their global competitiveness against rivals like TSMC and Intel.

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虎嗅35d ago

Memory giants sued over DRAM price manipulation

Samsung, SK Hynix, and Micron are facing a class-action lawsuit for allegedly colluding to restrict DRAM supply to prioritize high-margin HBM for AI, driving up memory prices.

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IT之家37d ago

Samsung and SK Hynix to Announce Massive AI Chip Investment

Samsung Electronics and SK Hynix are set to announce a 10-year investment plan exceeding 1,000 trillion KRW to expand semiconductor clusters in response to explosive AI chip demand.

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IT之家40d ago

Micron Q3 2026 Revenue Soars 345% Driven by AI

Micron reported record-breaking Q3 2026 financial results with a 345% revenue increase and 1398% net profit growth. The surge is primarily driven by massive demand for AI-related memory products in data centers.

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IT之家45d ago

Intel and Musk Partner on Terafab AI Chip Project

Intel CEO Lip-Bu Tan announced a collaboration with Elon Musk to utilize Intel's 14A process for manufacturing chips for Tesla's robots, vehicles, and data centers. The partnership aims to address the critical gap between AI infrastructure growth and semiconductor supply capacity.

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IT之家45d ago

Imec, TSMC, ASML achieve 50nm 2D material transistor integration

Imec, TSMC, and ASML have successfully integrated n-type and p-type 2D material transistors on a 300mm wafer with a 50nm contacted gate pitch. This breakthrough brings 2D semiconductors closer to commercial logic chip manufacturing.

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cnBeta (Full RSS)47d ago

ASML Unveils Hyper-NA EUV for Sub-0.7nm Nodes

ASML has announced its technical roadmap for the next-generation Hyper-NA EUV lithography systems. This technology is designed to support semiconductor manufacturing beyond the 0.7nm node, addressing future AI compute scaling needs.

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36氪18d ago

HKC Invests 4B RMB in Advanced Packaging Facility

HKC Corporation plans to invest 4 billion RMB to establish a subsidiary for an advanced semiconductor packaging and testing project. The project will focus on 12-inch hybrid chip packaging with a capacity of 20 million units per month.

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Computerworld18d ago

Apple and TSMC expand US chip manufacturing footprint

Apple is deepening its US-based supply chain through a $30 billion deal with Broadcom and expanded investments with TSMC. These partnerships aim to establish an end-to-end silicon ecosystem in America, covering everything from advanced 2nm processors to packaging facilities.

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虎嗅19d ago

ChangXin Memory's HBM Strategy and Technical Gap

An analysis of ChangXin Memory's entry into the HBM market, highlighting the technical challenges of vertical stacking and the competitive gap with global leaders like SK Hynix.

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钛媒体19d ago

TSMC Q2 profit surges 77% amid rising capital expenditure

TSMC reported a record-breaking 77% increase in Q2 net profit, driven by strong demand for advanced process nodes. The company is further increasing its capital expenditure for the next three years to expand capacity.

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36氪20d ago

Samsung to outsource Google TPU backend design

Samsung Electronics is considering outsourcing the backend design of Google's TPU I/O chips to Korean design service firms. This move aims to address growing foundry demand and optimize production efficiency.

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36氪20d ago

ASML: China demand driven by logic chip sector

ASML CFO Roger Dassen projects that China will account for approximately 20% of net sales in 2026. The growth is primarily fueled by domestic demand for logic chips rather than memory.

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36氪20d ago

Samsung Plans New DRAM Factory to Meet AI Demand

Samsung Electronics is planning a new DRAM factory in Giheung, South Korea, with a monthly capacity of 100,000 wafers. The investment aims to address the surging demand for high-performance memory chips driven by the AI infrastructure boom.

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cnBeta (Full RSS)20d ago

Samsung Wins Anthropic 2nm AI Chip Contract

Samsung Foundry has secured a contract to manufacture AI chips for Anthropic using its 2nm process. This partnership is expected to boost Samsung's foundry revenue and strengthen its position in the competitive AI semiconductor market.