Fabs, process nodes, HBM and the supply chain that everything in AI ultimately depends on.
389 articles
The US Department of Commerce has awarded SandboxAQ $500 million under the CHIPS Act. The funding aims to leverage AI to discover new chemicals and metals for domestic semiconductor manufacturing, reducing reliance on Chinese supply chains.
The Next Web (TNW) · 94d ago
Intel introduced the 18A-P process node, an enhancement of 18A, offering significant power and performance gains. The process will debut in the 'Diamond Rapids' product line.
cnBeta (Full RSS) · 94d ago
Intel has detailed its future roadmap focusing on three key technologies: CFET, Gallium Nitride (GaN) on silicon, and Ruthenium interconnects. These innovations aim to push the boundaries of process node scaling.
量子位 · 94d ago
Morgan Stanley reports that Intel's next-generation 14A process node has achieved a defect density (D0) of approximately 0.5. This indicates strong yield maturity ahead of the trial production phase, signaling a positive outlook for Intel's foundry business.
cnBeta (Full RSS) · 95d ago
The RISC-V architecture is achieving large-scale commercialization in China. The ecosystem is expanding rapidly across various hardware applications.
钛媒体 · 95d ago
TSMC is expected to significantly increase the pricing for its 2nm wafer production due to rising material and inflation costs. This shift may force major AI chip customers like Nvidia and Apple to reconsider Samsung as a viable foundry alternative.
cnBeta (Full RSS) · 96d ago
SK Hynix is planning a US listing on the Nasdaq exchange, likely as early as August, to capitalize on its strong AI-related growth. The company aims to leverage Nasdaq's tech-heavy investor base to secure higher valuations similar to peers like Micron.
IT之家 · 99d ago
Despite increasing monthly capacity to 175,000 wafers, TSMC continues to face supply shortages due to high demand for advanced AI chips. Consequently, the company is planning a 15% price hike for its 3nm foundry services in the second half of 2026.
TechNode · 99d ago
TSMC is developing a new packaging technology called CoPoS (Chip-on-Panel-on-Structure). It utilizes a glass-based three-layer sandwich structure to improve chip performance and integration.
cnBeta (Full RSS) · 99d ago
Google is shifting some of its AI chip production to Samsung to mitigate supply chain constraints. This move highlights the intense global competition for manufacturing capacity to support AI infrastructure.
Pandaily · 99d ago
Chinese start-up Prinano has successfully validated mass production of 8-inch photonic chip wafers. The process utilizes nanoimprint technology, bypassing the need for expensive DUV lithography equipment at a fraction of the cost.
SCMP Technology · 103d ago
The US Bureau of Industry and Security has issued new guidance regarding export licenses for advanced AI chips. While China's Ministry of Commerce has criticized the move as an abuse of control, industry experts suggest the actual impact on firms may be limited.
SCMP Technology · 105d ago
TSMC CEO C.C. Wei warns that global chip supply will remain insufficient to meet the explosive demand driven by AI development.
Bloomberg Technology · 107d ago
Researchers at the University of Illinois Urbana-Champaign successfully stacked three active silicon layers with 98-100% transistor yield. This breakthrough offers a new path for increasing compute density as Moore's Law nears physical limits.
cnBeta (Full RSS) · 111d ago
BYD has officially released the 'Xuanji A3', China's first 4nm intelligent driving chip, capable of supporting L3 and L4 autonomous driving. The chip features a total computing power of 2100 TOPS through a three-chip synergy architecture.
36氪 · 112d ago
TSMC executive Zhang Xiaogiang addressed the 'Huawei Tao Law', stating the concept of component integration has existed for a long time. He emphasized that power consumption and 3D stacking are the true critical factors for chip performance.
cnBeta (Full RSS) · 113d ago
BYD has officially released the Xuanji A3, China's first 4nm autonomous driving chip. The chip supports L3 and L4 autonomous driving and comes with a one-year accident liability coverage policy for urban navigation.
cnBeta (Full RSS) · 113d ago
Nvidia is planning a massive $150 billion annual investment to establish Taiwan as a global epicenter for AI development. This move signals a strategic shift in hardware supply chain dependency despite US-centric policy efforts.
Ars Technica AI · 115d ago
Huawei introduces the 'Tau Law' (τ-Law), shifting focus from geometric scaling (nanometers) to 'time scaling' by optimizing signal propagation and logic folding to improve chip performance. The company plans to achieve 1.4nm-equivalent transistor density by 2031 through system-level architectural innovation.
虎嗅 · 115d ago
The Trump administration has committed a $1 billion grant to support IBM in building a dedicated foundry for quantum computing chips. This initiative is part of a broader national strategy to secure leadership in the emerging quantum technology sector.
Bloomberg Technology · 121d ago
The A-share semiconductor sector is experiencing a high-growth phase driven by AI computing demand and memory price hikes. Despite valuation concerns, structural growth in domestic substitution and advanced packaging provides a solid fundamental foundation.
虎嗅 · 122d ago
Samsung Electronics faces its largest strike in history due to disputes over performance bonuses. The potential production disruption in DRAM and NAND markets could trigger price volatility in the global semiconductor supply chain.
虎嗅 · 122d ago
Nvidia is expanding its AI footprint by establishing a new R&D center in Singapore. This facility marks the company's first R&D hub in the country and its second in the Asia-Pacific region.
36氪 · 122d ago
TSMC’s monthly 2nm wafer capacity is reportedly expected to reach 100,000 wafers as AI customers shift toward advanced 3nm and 2nm processes. Strong orders from major customers are prompting the foundry to revise its production capacity plans.
TechNode · 45d ago
ChangXin Memory Technologies (CXMT) is finalizing validation for its LPDDR6 mobile DRAM, targeting a 12,800 Mbps design rate. The company is positioning itself for mass production by H2 2026, with Apple currently evaluating the technology.
Pandaily · 49d ago
The upcoming earnings week features major tech firms like Alphabet, Intel, and Tesla, which will serve as a litmus test for AI investment logic. Market sentiment remains cautious due to geopolitical tensions and the high valuation of semiconductor stocks.
虎嗅 · 62d ago
Longsys (Huaqin Technology) subsidiary acquired 6.26 million H-shares of JCET (Jinghe Integration) for 189 million HKD. This increases the group's total stake in JCET to 10.48%.
36氪 · 64d ago
Japanese memory chip maker Kioxia has seen its market value drop by 51% from its peak last month. The decline follows investor concerns over the high valuations of AI-related memory and storage stocks.
36氪 · 64d ago
As CXMT prepares for a potential IPO, industry analysts are evaluating its ability to compete with global DRAM giants like Samsung, SK Hynix, and Micron. The company faces significant challenges in sustaining growth beyond the current memory industry super-cycle.
钛媒体 · 65d ago
Universal Scientific Industrial (USI) announced a 50 million RMB investment in the Shanghai Shangce Xingrong Chip Fund. The fund aims to raise 800 million RMB to support the integrated circuit industry.
36氪 · 65d ago