Latest AI Hardware News & Updates
GPUs, TPUs, ASICs and the devices they power. The physical substrate of the AI boom, from datacenter chips to edge gadgets.
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TSMC Enters Silicon Bridge Packaging Market
TSMC is reportedly developing a 'quasi-EMIB' packaging technology in collaboration with Kinsus Interconnect Technology to compete with Intel's EMIB. This move aims to address CoWoS capacity shortages and reduce costs for mid-range AI chips.
Ulanzi: Scaling Hardware to Global Leadership
Ulanzi founder William discusses the strategy behind scaling a hardware company to global leadership in 11 years, focusing on rapid product iteration and AI-driven management.
G1X: The first desktop full-color 3D printer
Blacktech's G1X 3D printer raised $10 million on Kickstarter, introducing material jetting technology to the consumer market for high-quality, full-color prints.
Google Develops Frozen Chip for Gemini AI Efficiency
Google is developing a new 'Frozen' chip architecture designed to significantly enhance the operational efficiency of its Gemini AI models. This hardware innovation aims to optimize compute resources for large-scale model inference.
Japan to Acquire 27,500 Nvidia Rubin Chips for Robotics
Japan is investing 387.3 billion yen to establish Noetra Corp, a new entity tasked with building large-scale data centers for robotics AI. The project involves a massive procurement of 27,500 next-generation Nvidia Rubin chips to power domestic AI foundation models.
ByteDance and ZTE Launch Second-Gen AI Agent Phone
ByteDance and ZTE have launched the 'Doubao Second-Gen Phone' (Nubia NaviX Ultra), which integrates native AI agents capable of autonomous app operation. Unlike the first generation, this model is mass-produced and faces stiff competition from major smartphone manufacturers.
Japan to procure 27,500 Nvidia Rubin chips for robotics
Japan plans to acquire 27,500 Nvidia Rubin AI chips to develop a domestic robotics foundation model. The project, led by the newly formed Noetra, aims to reduce reliance on foreign technology and capture a significant share of the global robotics market by 2040.
TSMC Increases US Investment to $265 Billion
TSMC Chairman C.C. Wei announced an additional $100 billion investment in US operations, bringing the total commitment to $265 billion. This expansion includes six wafer fabs, three advanced packaging facilities, and a major R&D center.
TSMC Commits $265 Billion to US Chip Manufacturing Expansion
TSMC is investing an additional $100 billion to expand its US chipmaking capacity. This initiative is part of a broader US-Taipei agreement to localize semiconductor manufacturing and secure the supply chain.
TSMC Beats Estimates Amid Sustained AI Demand
TSMC reported quarterly profits that exceeded market expectations. This performance underscores the ongoing strong global demand for AI computing hardware.
Nokia and Nvidia Unveil AI-Powered Network Technology
Nokia and Nvidia have developed new AI-powered network technology capable of doubling data transmission capacity. This is the first major output from their ongoing strategic partnership.
ASML Q2 Revenue Hits โฌ9.3B, Raises 2026 Guidance
ASML reported strong Q2 2026 results with โฌ9.3 billion in revenue and a 54% gross margin. The company raised its full-year guidance, citing robust demand for semiconductor manufacturing equipment.
OpenAI and StepFun challenge the AI hardware market
OpenAI and StepFun are aggressively entering the AI hardware space, signaling a new wave of competition. This move challenges existing players and highlights the integration of LLMs into physical devices.
StepFun pivots to AI-native hardware and agents
StepFun shifts its strategy from pure model development to an integrated approach of models, software, and hardware, focusing on AI-native smartphones as the primary entry point for intelligent agents.
VC Perspectives on the First AI Agent Smartphone
The launch of the first AI agent smartphone raises critical questions about technical architecture, business sustainability, and the evolving relationship between model companies and hardware manufacturers.
Intel invests โฌ5B in Ireland for AI chip capacity
Intel is investing an additional 5 billion euros in its Leixlip facility in Ireland to boost AI and high-performance computing chip production. The investment focuses on upgrading facilities for Intel 3 process nodes and expanding Xeon 6 server processor capacity.
StepFun launches world's first native agentic phone
StepFun (Jieyue Xingchen) has unveiled the world's first native agentic phone, featuring the Step AOS operating system and the Amoo agent. The device integrates model, software, and hardware into a unified AI-native experience.
TSMC June Revenue Grows 67.9% Year-over-Year
TSMC reported June revenue of 442.68 billion TWD, marking a 67.9% increase year-over-year and 6.2% month-over-month. Total revenue for the first half of 2026 reached 2.4 trillion TWD, up 35.6%.
AMD to launch Zen 6 EPYC Venice CPU
AMD is expected to unveil its EPYC Venice CPU based on the Zen 6 architecture at the upcoming Advancing AI event. The new processor promises a performance and energy efficiency improvement of over 70% compared to its Zen 5 predecessor.
Samsung Q2 profit surges on AI memory demand
Samsung Electronics reports a massive surge in Q2 2026 profits, driven by the high demand for AI-focused memory products like HBM4 and the development of UFS 5.0 storage solutions.
Quantum Computing Costs: 60% Spent on Control Systems
Jin Yirong, founder of Coherent Technology, explains that as quantum computers scale, the cost of control and measurement electronics becomes the dominant factor, accounting for over 60% of total system expenses.
Micron invests $9.3B to expand advanced HBM production
Micron has launched a $9.3 billion expansion at its Hiroshima plant to produce HBM for AI processors, with shipments expected by late 2028. This follows similar capacity expansion announcements from Samsung and SK Hynix.
Which USB adapters should you keep in 2026?
As USB-C becomes the universal standard, users should audit their collection of legacy adapters. It is time to discard obsolete hardware to reduce clutter.
Kai Dynamics launches KAI Hand and data collection hardware
Embodied AI startup Kai Dynamics has launched its KAI Hand dexterous manipulator and KAI Halo Lite data collection headset, expanding from full-body robots to modular hardware components.
HKC Invests 4B RMB in Advanced Packaging Facility
HKC Corporation plans to invest 4 billion RMB to establish a subsidiary for an advanced semiconductor packaging and testing project. The project will focus on 12-inch hybrid chip packaging with a capacity of 20 million units per month.
BES chips power the 'night shift' in AI glasses
Hengxuan Technology (BES) is positioning itself as a key supplier for AI glasses by providing low-power chips that handle background tasks while high-performance chips (like Qualcomm's) handle heavy AI processing. The company is developing the BES6100 to integrate both functions into a single chip.
Saronic to Build $3.2B Shipyard for Maritime AI Drones
Austin-based startup Saronic is planning a $3.2 billion investment to build a new shipyard in South Texas. This expansion follows the first successful combat deployment of their autonomous maritime drones by the US military.
TSMC Q2 profit surges 77% amid rising capital expenditure
TSMC reported a record-breaking 77% increase in Q2 net profit, driven by strong demand for advanced process nodes. The company is further increasing its capital expenditure for the next three years to expand capacity.
Apple seeks acquisitions to bolster AI chip development
Apple is actively seeking to acquire AI chip startups to overcome bottlenecks in its internal server infrastructure. The company has engaged with bankers to address its inability to design AI-specific chips fast enough to meet demand.
ASML accelerates EUV machine production by 30%
ASML is reducing the cycle time for its extreme ultraviolet (EUV) lithography machines by approximately 30% to meet surging AI-driven demand. The company aims to shorten the period between clean room production and shipping.