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Intel EMIB Yield Hits 90% for AI Chips

Intel EMIB Yield Hits 90% for AI Chips

Analyst Jeff Pu reports Intel's EMIB packaging tech achieved 90% yield, matching FCBGA while enabling higher interconnect density for AI data center chips. EMIB-T variant supports large-scale HBM integration. Intel plans EMIB-T expansion to over 12x reticle by 2028.

Fujitsu shows 144-core MONAKA CPU sample

Fujitsu shows 144-core MONAKA CPU sample

Fujitsu and 1FINITY showcased first wafers and engineering samples of next-gen MONAKA CPU at MWC 2026. The processor targets data centers and high-performance computing with 144 cores and 3.5D packaging. It has entered the runnable stage.

cnBeta (Full RSS)MediaMar 9#cpu#hpc#packaging