Source36氪•Stalecollected in 5m
Samsung may drop FOWLP for Exynos 2700 chip
Chip packaging directly impacts thermal throttling in mobile AI; see how Samsung's cost-cutting affects performance.
30-Second TL;DR
What Changed
Exynos 2700 is currently in development for next year's flagship smartphones.
Why It Matters
This shift could affect the thermal efficiency and performance-per-watt of future mobile AI workloads on Samsung devices.
What To Do Next
Monitor Samsung's supply chain announcements to understand how chip packaging changes impact mobile AI hardware performance.
Who should care:Developers & AI Engineers
Key Points
- •Exynos 2700 is currently in development for next year's flagship smartphones.
- •FOWLP technology was previously used in the Exynos 2400.
- •High manufacturing costs are the primary driver for the potential shift.
Deep Insight
Background and context from public sources — not the original article. 19 sources cited.
Enhanced Key Takeaways
- •Samsung is exploring a Side-by-Side (SbS) packaging design as an alternative to FOWLP for the Exynos 2700, which involves placing the application processor and memory chips next to each other rather than stacking them vertically.
- •The Exynos 2600, used in the Galaxy S26 series, already incorporates a Heat Pass Block (HPB) technology, a copper-based heat spreading structure, which is expected to be retained in the Exynos 2700 even if FOWLP is dropped.
- •The potential shift away from FOWLP is primarily driven by high manufacturing complexity, significant cost burden, and associated yield risks, particularly for chips produced in more limited volumes.
- •The Exynos 2700 is slated for mass production in the second half of 2026, utilizing Samsung Foundry's second-generation 2nm Gate-All-Around (GAA) fabrication process (SF2P), with a goal to power approximately 50% of the upcoming Galaxy S27 devices.
- •There are conflicting reports, with some sources suggesting Samsung may ultimately retain FOWLP for the Exynos 2700 to ensure competitive performance against rivals like Qualcomm and MediaTek, implying the initial reports might have been strategic leaks.
Competitor Analysis
Packaging Strategy
- Samsung Exynos 2700 (Planned)
- Considering Side-by-Side (SbS) with Heat Pass Block (HPB), potentially dropping FOWLP.
- Qualcomm Snapdragon (Competitor)
- Expected to adopt fan-out WLP/PLP technology.
- MediaTek Dimensity (Competitor)
- Expected to adopt fan-out WLP/PLP technology.
Process Node
- Samsung Exynos 2700 (Planned)
- Second-generation 2nm Gate-All-Around (GAA) (SF2P).
- Qualcomm Snapdragon (Competitor)
- Preparing first 2nm family (Snapdragon 8 Elite Gen 6/Pro).
- MediaTek Dimensity (Competitor)
- Preparing next-generation 2nm SoC.
Thermal Management
- Samsung Exynos 2700 (Planned)
- HPB for improved heat dissipation, SbS to expand heat dissipation area.
- Qualcomm Snapdragon (Competitor)
- Advanced packaging aims for improved thermal performance.
- MediaTek Dimensity (Competitor)
- Focus on performance and power efficiency for flagship chips.
Cost Implications
- Samsung Exynos 2700 (Planned)
- High manufacturing complexity and cost pressure for FOWLP are driving re-evaluation.
- Qualcomm Snapdragon (Competitor)
- Costs associated with advanced packaging are a factor.
- MediaTek Dimensity (Competitor)
- Cost-efficiency is a key advantage of FOWLP in high-volume production.
Market Position
- Samsung Exynos 2700 (Planned)
- Aims to power ~50% of Galaxy S27 devices, reducing reliance on Qualcomm.
- Qualcomm Snapdragon (Competitor)
- Dominant in premium Android flagship market.
- MediaTek Dimensity (Competitor)
- Strong market share in India, expanding premium portfolio.
| Feature/Aspect | Samsung Exynos 2700 (Planned) | Qualcomm Snapdragon (Competitor) | MediaTek Dimensity (Competitor) |
|---|---|---|---|
| Packaging Strategy | Considering Side-by-Side (SbS) with Heat Pass Block (HPB), potentially dropping FOWLP. | Expected to adopt fan-out WLP/PLP technology. | Expected to adopt fan-out WLP/PLP technology. |
| Process Node | Second-generation 2nm Gate-All-Around (GAA) (SF2P). | Preparing first 2nm family (Snapdragon 8 Elite Gen 6/Pro). | Preparing next-generation 2nm SoC. |
| Thermal Management | HPB for improved heat dissipation, SbS to expand heat dissipation area. | Advanced packaging aims for improved thermal performance. | Focus on performance and power efficiency for flagship chips. |
| Cost Implications | High manufacturing complexity and cost pressure for FOWLP are driving re-evaluation. | Costs associated with advanced packaging are a factor. | Cost-efficiency is a key advantage of FOWLP in high-volume production. |
| Market Position | Aims to power ~50% of Galaxy S27 devices, reducing reliance on Qualcomm. | Dominant in premium Android flagship market. | Strong market share in India, expanding premium portfolio. |
Technical Deep Dive
- FOWLP (Fan-Out Wafer-Level Packaging):
- A high-density advanced packaging technology where electrical connections and molding are completed at the wafer stage.
- Places electrical connections (Redistribution Layers - RDLs) outside the die area, allowing for more I/O pins and a smaller, thinner package.
- Integrates the chip on a silicon wafer substrate rather than a Printed Circuit Board (PCB), which significantly improves heat dissipation.
- Reduces parasitic effects and shortens circuit paths, leading to faster signal transmission and reduced power consumption.
- Can reduce thermal resistance by up to 16% and make chips 40% smaller.
- Eliminates the need for a package substrate and wire bonding, potentially reducing production costs by up to 30% at scale.
- Side-by-Side (SbS) Packaging Design (Proposed Alternative):
- Places the application processor (AP) and memory chips (DRAM) adjacent to one another on the substrate, rather than stacking them vertically.
- Increases the horizontal surface area of the package, which can help improve heat dissipation and overall efficiency.
- Can make the chip package vertically thinner, which is beneficial for slim smartphones.
- Heat Pass Block (HPB) Technology:
- An additional thermal enhancement technology that embeds a copper-based heat spreading structure within the package-on-package (PoP) architecture.
- Improves heat transfer between the processor and stacked DRAM.
- In an SbS configuration, the HPB would be placed on top of both the processor and DRAM to quickly dissipate heat from both components.
Future ImplicationsAI analysis grounded in cited sources
Samsung will likely prioritize cost-efficiency and yield stability in its future Exynos chip development.
The re-evaluation of FOWLP for the Exynos 2700 due to high manufacturing costs and yield risks indicates a strategic shift towards more profitable production methods, even if it means exploring alternative packaging.
The Exynos 2700, regardless of FOWLP adoption, will aim for enhanced AI performance and a larger market share within Samsung's own devices.
Samsung has publicly stated its intention to expand market share with the Exynos 2700 by offering enhanced AI performance and aims to power around 50% of Galaxy S27 devices.
Samsung's packaging strategy for future Exynos chips may become more flexible, adapting to specific product needs and market conditions.
The consideration of both FOWLP and SbS, along with the continued use of HPB, suggests Samsung is willing to combine or switch packaging technologies to balance performance, cost, and form factor requirements.
Timeline
2000s
Concept of Fan-Out Wafer-Level Packaging (FOWLP) emerged.
2016
TSMC commercialized FOWLP (InFO) for Apple's A10 processor, displacing Samsung from Apple's supply chain due to Samsung's slower adoption.
2024
Samsung adopted FOWLP technology for its Exynos 2400 processor, used in the Galaxy S24 and S24+ in select regions.
2025-12
Samsung's System LSI division completed the design of the Exynos 2700.
2026-01
Samsung introduced the Galaxy S26 series, featuring the Exynos 2600 which continued to use WLP and incorporated Heat Pass Block (HPB) technology.
2026-H2
Samsung plans to begin mass production of the Exynos 2700 using its 2nm SF2P fabrication process.
- 2000sConcept of Fan-Out Wafer-Level Packaging (FOWLP) emerged.
- 2016TSMC commercialized FOWLP (InFO) for Apple's A10 processor, displacing Samsung from Apple's supply chain due to Samsung's slower adoption.
- 2024Samsung adopted FOWLP technology for its Exynos 2400 processor, used in the Galaxy S24 and S24+ in select regions.
- 2025-12Samsung's System LSI division completed the design of the Exynos 2700.
- 2026-01Samsung introduced the Galaxy S26 series, featuring the Exynos 2600 which continued to use WLP and incorporated Heat Pass Block (HPB) technology.
- 2026-H2Samsung plans to begin mass production of the Exynos 2700 using its 2nm SF2P fabrication process.
Sources (19)
Factual claims are grounded in the sources below. Forward-looking analysis is AI-generated interpretation.
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