LG Launches Maskless Chip-Packaging Lithography
💡LG’s new maskless lithography could ease packaging bottlenecks holding back high-density AI chips.
⚡ 30-Second TL;DR
What Changed
LG is entering chip packaging with a Laser Direct Imaging lithography machine.
Why It Matters
Additional chip-packaging equipment could help address bottlenecks affecting advanced AI accelerators and other high-density chips. LG’s throughput-focused approach may be attractive for production lines where manufacturing capacity matters more than the finest pattern resolution.
What To Do Next
Ask your packaging partner for LG’s LDI minimum feature size, throughput, and substrate compatibility before considering it for an AI accelerator supply chain.
Key Points
- •LG is entering chip packaging with a Laser Direct Imaging lithography machine.
- •The maskless system is designed to pattern fine interconnects.
- •It prioritizes higher throughput over maximum resolution.
- •The machine targets chip packaging and high-density PCB applications.
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Original source: Tom's Hardware ↗
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