Murata releases simulation models for Ansys HFSS and Icepak

🔑 Enhanced Key Takeaways

•Murata's initiative is a direct collaboration with Synopsys, Inc., the parent company of Ansys, signifying a strategic partnership with a major Electronic Design Automation (EDA) tool provider.
•Murata is recognized as the first company to offer passive component simulation models specifically engineered for Ansys Icepak, addressing critical thermal analysis needs in electronic design.
•The released models are compatible with Ansys 2026 R1 and specifically support Murata's RF inductors and multilayer ceramic capacitors (MLCCs) for electromagnetic analysis (HFSS), and power inductors for thermal analysis (Icepak).
•The high accuracy of Murata's simulation models stems from their vertically integrated approach, which spans raw material development to final product processing, enabling the use of extensive proprietary datasets that closely mirror real-world component performance.
•This integration directly addresses the growing complexity of modern electronic circuit design, particularly the challenges posed by electromagnetic interference (EMI) and significant component heat generation in the context of increasing demand for high-speed, high-capacity communications.

🛠️ Technical Deep Dive

The simulation models are specifically designed for compatibility with Ansys 2026 R1 software.
For electromagnetic field analysis using Ansys HFSS, Murata provides models for its RF inductors and multilayer ceramic capacitors (MLCCs).
For thermal analysis using Ansys Icepak, models are available for Murata's power inductors.
Ansys Icepak functions as a Computational Fluid Dynamics (CFD) solver for electronics thermal management, leveraging the Ansys Fluent solver to predict airflow, temperature, and heat transfer, including conduction, convection, and radiation.
Ansys HFSS is a 3D full-wave electromagnetic field simulation software, considered a standard for predicting high-frequency behavior and mitigating EMI.
Murata's model development benefits from its vertically integrated manufacturing process, which generates proprietary datasets ensuring the models accurately reflect actual component behavior under various design conditions.
Beyond Ansys, Murata also offers design support through its SimSurfing tool, providing S-parameters, SPICE models, and characteristics like capacitance-DC bias and capacitance-temperature for various components.
Murata previously integrated static and dynamic component models for approximately 1,600 power inductors and 5,000 RF inductors into Cadence EDA tools, including OrCAD X Capture, Allegro X System Capture, and AWR Design Environment.

🔮 Future ImplicationsAI analysis grounded in cited sources

Accelerated product development cycles for electronic devices.

Providing high-fidelity simulation models directly compatible with industry-standard tools significantly reduces the need for physical prototyping and costly redesigns, thereby streamlining and speeding up the overall design process.

Enhanced adoption of Murata components in complex high-frequency and power electronics designs.

By simplifying the integration and accurate simulation of their components, Murata makes it easier for engineers to incorporate their parts into designs that face critical challenges like electromagnetic interference and thermal management.

Deeper collaboration between component manufacturers and EDA tool providers will become a standard industry practice.

Murata's strategic partnership with Synopsys (Ansys) and its prior collaboration with Cadence indicate a growing trend towards direct integration of component models into design environments to meet the increasing complexity of electronic system design.

⏳ Timeline

1944-10

Akira Murata founded Murata Manufacturing, initially producing ceramic insulators.

2012-04-13

Murata acquired RF Monolithics, expanding its capabilities in radio frequency components.

2014-08-23

Murata acquired Peregrine Semiconductor Corporation, further strengthening its RF technology portfolio.

2022-10-27

Murata entered a multiyear agreement with Ansys to leverage simulation tools for developing next-generation wireless communication components.

2025-10-21

Murata integrated component models directly into Cadence EDA tools, including OrCAD X Capture and AWR Design Environment, to streamline circuit design.

2026-06-16

Murata launched simulation models for Ansys HFSS and Icepak, in collaboration with Synopsys, for electromagnetic and thermal analysis.