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Galaxy S26 FE Rumored with Exynos 2500

Galaxy S26 FE Rumored with Exynos 2500

Samsung Galaxy S26 FE is rumored to feature the Exynos 2500 chip and launch in September at Galaxy Unpacked alongside foldables. Geekbench scores show 2426 single-core and 8004 multi-core performance with 8GB RAM. This aligns with FE series' cost-saving use of near-flagship chips.

IT之家MediaMay 8#mobile-soc#arm-cpu#exynos-chip
Lenovo Legion Y900 13" Specs Teased

Lenovo Legion Y900 13" Specs Teased

Lenovo has revealed key specs for its Legion Y900 13-inch gaming tablet, including a Snapdragon 8 Elite chip, 4K 144Hz display, and Harman Kardon 6 speakers. It features massive cooling, stylus support, and PC-level app compatibility. Full launch set for May 19 alongside other products.

Dimensity 9600 Pro Leaks 5GHz Cores, 12K Multi-Core

Dimensity 9600 Pro Leaks 5GHz Cores, 12K Multi-Core

Leaked Geekbench scores for MediaTek Dimensity 9600 Pro reveal dual super-large cores nearing 5GHz, with multi-core exceeding 12,000 on early ES samples. Built on TSMC N2p process, it features 2xCanyon+3xGelas-b+3xGelas architecture, SME2 AI support, Arm Magni GPU, and LPDDR6+UFS 5.0. OPPO and vivo Pro Max flagships likely to adopt full-spec versions.

Samsung Trials Exynos 2700 Production

Samsung Trials Exynos 2700 Production

Samsung has started trial production of the next-gen Exynos 2700 mobile SoC after completing pre-silicon design, targeting sample completion by May-June 2025. The chip, built on SF2P process, is slated for Galaxy S27 debut and aims to boost in-house adoption in flagships. This reduces MX division's external AP procurement costs amid rising memory prices.

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