🔥36氪•Stalecollected in 9m
Yisheng New Materials Lands Tens-Millions A-Round
💡Huawei-funded thermal firm scales for AI chip heat management needs
⚡ 30-Second TL;DR
What Changed
Secured tens of millions RMB in A-round funding
Why It Matters
Strengthens supply chain for high-power AI chips and data centers, with Huawei backing signaling strategic push in thermal solutions for compute-intensive workloads.
What To Do Next
Contact Yisheng for metal thermal solutions to optimize cooling in your custom AI server designs.
Who should care:Founders & Product Leaders
Key Points
- •Secured tens of millions RMB in A-round funding
- •Investors include Huawei Hubble and Zhongguancun Qihang
- •Focus on production line upgrades and capacity expansion
- •R&D for advanced thermal management materials
🧠 Deep Insight
Background and context from public sources — not the original article. 7 sources cited.
🔑 Enhanced Key Takeaways
- •Yisheng New Material's diamond/aluminum composite achieves 550-750W/(m·k) thermal conductivity and diamond/copper reaches 750-980W/(m·k), exceeding performance benchmarks from international competitors Sumitomo Electric and Plansee[1]
- •The company leverages the national-level metal matrix composite engineering laboratory at Harbin Institute of Technology, providing access to advanced research infrastructure and core technologies in interface control and net forming[1]
- •Post-funding production capacity will scale from small-batch laboratory output to 1 million pieces annually per machine, with plans to achieve tens of millions of pieces yearly through equipment expansion[1]
📊 Competitor Analysis▸ Show
| Aspect | Yisheng New Material | Sumitomo Electric | Plansee |
|---|---|---|---|
| Diamond/Aluminum Thermal Conductivity | 550-750 W/(m·k) | Lower (referenced as benchmark) | Lower (referenced as benchmark) |
| Diamond/Copper Thermal Conductivity | 750-980 W/(m·k) | Lower (referenced as benchmark) | Lower (referenced as benchmark) |
| Production Scale | 1M+ pieces/year (post-funding) | Established international scale | Established international scale |
| Core Technology | Interface control, net forming, low-cost processes | Mature manufacturing | Mature manufacturing |
🛠️ Technical Deep Dive
- Material Composition: Diamond/aluminum and diamond/copper composite systems with controlled interface properties
- Thermal Performance: Diamond/aluminum composites reach 550-750W/(m·k); diamond/copper composites reach 750-980W/(m·k)
- Key Technologies: Interface control technology, net forming technology for complex components, low-cost manufacturing processes
- Cyclic Stability: Materials maintain performance stability through thermal cycling
- Production Method: Automatic infiltration equipment (self-developed) enabling high-volume manufacturing
- Competitive Advantage: Performance metrics exceed similar products from Sumitomo Electric (Japan) and Plansee (Austria)[1]
🔮 Future ImplicationsAI analysis grounded in cited sources
Yisheng will become a significant domestic supplier of high-performance thermal management materials for electronics and semiconductor applications
Scaling from laboratory batch production to 1M+ annual units positions the company to serve growing demand in thermal management across consumer electronics, data centers, and automotive sectors[1]
Huawei's investment signals strategic vertical integration in thermal management supply chains for semiconductor and device manufacturing
Huawei Hubble's participation as lead investor suggests the company is securing domestic sources for critical thermal materials to reduce supply chain dependencies[1]
Diamond composite materials will increasingly displace traditional copper and aluminum solutions in high-performance thermal applications
Superior thermal conductivity (750-980W/(m·k) vs. conventional materials) combined with scalable manufacturing enables adoption in next-generation electronics requiring advanced heat dissipation[1]
⏳ Timeline
2024-09
Yisheng New Material founded on September 18, 2024
2025-02
Series A funding round completed with Huawei Hubble and Zhongguancun Qihang Investment
📎 Sources (7)
Factual claims are grounded in the sources below. Forward-looking analysis is AI-generated interpretation.
- eu.36kr.com — 3697538397744775
- preqin.com — 737187
- pdf.dfcfw.com — H2 An202205201566794908 1
- foodtechx.com — Yisheng Company Profile
- szyishengkeji.en.alibaba.com — Company Profile
- vip.stock.finance.sina.com.cn — Vcb Allbulletindetail
- dnb.com — Company Profiles.anhui Yisheng New Energy Co Ltd.0c757c63202c151bba299d1fde784be7
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Original source: 36氪 ↗
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