Ascend 910C Completes Training of 1.6 Trillion Parameter Model

๐กFirst major proof that domestic hardware can handle 1T+ parameter model training, signaling a shift in AI infrastructure
โก 30-Second TL;DR
What Changed
Ascend 910C successfully trained a 1.6 trillion parameter model
Why It Matters
This breakthrough suggests that domestic Chinese hardware is becoming increasingly capable of handling frontier-scale model training, potentially reducing reliance on imported GPUs.
What To Do Next
Evaluate the Ascend 910C cluster performance metrics if you are building large-scale models for the Chinese market.
Key Points
- โขAscend 910C successfully trained a 1.6 trillion parameter model
- โขCollaboration between Huawei, Shenzhen Hetao College, and local research institutes
- โขDemonstrates viability of domestic hardware for large-scale model training
๐ง Deep Insight
Web-grounded analysis with 21 cited sources.
๐ Enhanced Key Takeaways
- โขThe 1.6 trillion parameter model successfully post-trained on the Ascend 910C is identified as DeepSeek-V4-Pro.
- โขThe training utilized a cluster of over 1,000 Huawei Ascend 910C chips.
- โขThe project achieved a Model Floating-point Utilization (MFU) exceeding 30% and a 14% improvement in key operator efficiency, with no system failures over 1,500+ training steps.
- โขThis milestone specifically involved 'full-parameter post-training,' which focuses on supervised fine-tuning (SFT) and reinforcement learning (RL) rather than pre-training from scratch.
- โขThe collaborative effort included Shenzhen Hetao College, Harbin Institute of Technology (Shenzhen), Shenzhen Institute of Big Data, and Huawei-related teams.
๐ Competitor Analysisโธ Show
Competitor Analysis: Huawei Ascend 910C vs. Key AI Accelerators
| Feature/Metric | Huawei Ascend 910C | Nvidia H100 (Hopper) | AMD Instinct MI300X | Intel Gaudi 3 |
|---|---|---|---|---|
| Process Node | SMIC 7nm (N+2) | TSMC 4nm (4NP) | TSMC 5nm + 6nm (chiplet) | TSMC 5nm |
| Architecture | Dual-die packaging (two Ascend 910B chips) | Hopper (monolithic) | CDNA 3 (chiplet) | Habana Labs custom |
| FP16 Performance | ~800 TFLOPS | ~1,979 TFLOPS (dense) | ~1,308 TFLOPS (dense) | ~1,835 TFLOPS (dense) |
| Memory Bandwidth | 3.2 TB/s | 3.35 TB/s | 5.3 TB/s | 3.7 TB/s |
| TDP | 550 W | 700 W | 750 W | 900 W |
| Relative Performance (vs. H100) | 60-80% (FP16) | 100% | ~75-80% (for training GPT-style models) | Not directly comparable, but strong training efficiency |
| Estimated Cost (per unit/solution) | 60-70% lower than H100 solutions | ~$25,000 - $30,000 (H100) | ~$8,000 - $10,000 (MI300X) | Not readily available |
| Interconnect Bandwidth | 512 GB/s bidirectional mesh (across cores) | 900 GB/s (NVLink) | 800 GB/s (Infinity Fabric) | 9.6 TB/s (Ethernet-based) |
| Ecosystem Maturity | Developing (CANN, MindSpore) | Mature (CUDA, extensive libraries) | Growing (ROCm) | Developing (Habana SynapseAI) |
๐ ๏ธ Technical Deep Dive
- Architecture: The Ascend 910C utilizes a dual-die packaging design, effectively integrating two Ascend 910B chips onto an organic substrate.
- Manufacturing Process: It is fabricated using SMIC's 7nm (N+2) process technology.
- Transistor Count: The chip contains approximately 53 billion transistors.
- Peak Throughput: The Ascend 910C offers a peak throughput of 800 TFLOPS for FP16 (BF16/FP16) operations. It also supports 100 TFLOPS for FP32 and 800 TOPS for INT8 tensor operations.
- Memory Bandwidth: It features a memory bandwidth of 3.2 TB/s.
- Thermal Design Power (TDP): The chip has a TDP of 550 W.
- AI Cores: Each Ascend 910C NPU integrates multiple AI cores, with some sources indicating 8 cores per chip (or 32+ in dual-die variants), each featuring a 256x256 Tensor (Cube) array.
- On-Chip Memory Hierarchy: Includes L1 Buffer (128โ512 KB/core), a 32 MB shared L2 Cache with 1 TB/s aggregate internal bandwidth, specialized L0A/L0B/L0C buffers for cube operand staging, and a 196 KB/core Unified Buffer (UB) for low-latency tile operations.
- Interconnects: Features a 512 GB/s bidirectional mesh network for inter-AI core communication, PCIe 4.0 ร16 (64 GB/s) for host-NPU communication, and supports Distributed HCCL (Huawei Collective Communication Library) over PCIe or TCP for multi-node clusters.
- Software Stack: The core software stack is the CANN (Compute Architecture for Neural Networks) framework, which provides low-level tools, runtime libraries, and over 1,000 operators. It includes AscendCL for unified programming and integrates with MindSpore, Huawei's PyTorch-like framework.
๐ฎ Future ImplicationsAI analysis grounded in cited sources
โณ Timeline
๐ Sources (21)
Factual claims are grounded in the sources below. Forward-looking analysis is AI-generated interpretation.
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Original source: Pandaily โ

