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🏠IT之家•#fab-expansion #dram-capacity #hbm-priority•Feb 20, 2026Freshcollected in 25m

Memory Giants Ramp Factories for AI Demand

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💡Massive fab expansions prioritize AI memory supply, signaling ongoing shortages for consumer hardware.

⚡ 30-Second TL;DR

What changed

Micron invests $200B, Boise fab with 60万 sq ft cleanroom boosting output 40%.

Why it matters

Eases AI training/inference supply constraints but sustains high prices and consumer GPU delays. Enterprises gain better access to high-bandwidth memory for scaling models.

What to do next

Contact Micron or SK Hynix sales for HBM procurement quotes to lock in AI cluster capacity.

Who should care:Enterprise & Security Teams

🧠 Deep Insight

Web-grounded analysis with 4 cited sources.

🔑 Key Takeaways

•Micron, Samsung, and SK Hynix are collaborating to prevent memory hoarding by customers, aiming to stabilize demand and encourage sustained production investments amid AI-driven needs[1].
•AI demand for high-bandwidth memory (HBM) is diverting capacity from legacy DRAM, causing shortages and sharp price increases for conventional DRAM in 2026, with Samsung's revenue per bit up 116%, SK Hynix 78%, and Micron 54%[2].
•SK Hynix leads HBM market with 62% shipment share in Q2 2025 and over 50% revenue dominance through 2026, supported by early HBM investments since 2013 and development of 12-layer HBM4 in September 2025[3].

📊 Competitor Analysis▸ Show

Company	HBM Market Share (2025-2026)	DRAM ASP Growth 2026	Key Strategy
SK Hynix	50-62%	78% to $0.70	HBM3E/HBM4 leader, Cheongju expansion[3]
Samsung	Not leading	116% to $0.79	Anti-hoarding, P4 fab acceleration
Micron	Growing	54% to $1.06	Powerchip partnership, US fabs[2]

🛠️ Technical Deep Dive

SK Hynix's 12-layer HBM4 (developed September 2025) features 2,048 input/output channels, doubling bandwidth from prior generations for AI processors[3].
HBM prioritized over LPDDR and legacy DRAM due to higher revenue per bit, with HBM ASP rises restrained (8% Samsung, 1% SK Hynix, 22% Micron) vs. explosive conventional DRAM gains[2].
Structural shift pulls high-quality DRAM wafers into HBM, reducing standard DRAM supply; NAND sees MLC end-of-life with Samsung final shipments June 2026[4].

🔮 Future ImplicationsAI analysis grounded in cited sources

AI HBM prioritization sustains high memory prices through 2026, squeezing consumer and legacy markets while boosting manufacturer margins; anti-hoarding measures may stabilize supply long-term but accelerate near-term price hikes for non-AI segments, with NAND constraints persisting beyond 2026[1][2][4].

⏳ Timeline

2013-01

SK Hynix begins early investment in HBM technology

2025-03

Samsung announces end of MLC NAND production

2025-06

Samsung final MLC NAND shipments

2025-09

SK Hynix develops 12-layer HBM4

2025-12

SK Hynix holds 62% HBM shipment share in Q4

📎 Sources (4)

Factual claims are grounded in the sources below. Forward-looking analysis is AI-generated interpretation.

Micron, Samsung, and SK Hynix are massively expanding fabs to meet AI-driven memory needs. Micron's $200B plan features a huge Boise campus with 15-20万 WPM capacity. Priority for HBM and AI modules means ongoing consumer shortages.

Key Points

1.Micron invests $200B, Boise fab with 60万 sq ft cleanroom boosting output 40%.
2.SK Hynix accelerates Yongin cluster trial production to Feb/Mar.
3.Samsung advances P4 fab completion to 2026 Q4 with 10-12万 WPM.
4.Capacity targets AI HBM/SOCAMM as LPDDR shifts from consumer to Nvidia AI.
5.Consumers face prolonged shortages despite expansions.

Impact Analysis

Eases AI training/inference supply constraints but sustains high prices and consumer GPU delays. Enterprises gain better access to high-bandwidth memory for scaling models.

Technical Details

Boise fab targets 15-20万 WPM; HBM meets agentic AI bandwidth needs; expansions add 40%+ to global DRAM output focused on rack-scale AI.

#fab-expansion #dram-capacity #hbm-prioritydram/hbm

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